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 Product
Engineering
- Failure
analysis capability:
- Electric
analysis : Tester, Curve tracer, Emission, LC.
- Inspection
: Optical microscope, SEM.
- Pakage
analysis : X-ary, SAT.
- Physical
analysis : Decap, EDX, FIB.
- CAR
capability:
- (D1)
Describe the problem
- (D2)
Establish the team
- (D3)
Containment action
- (D4)
Root cause analyze
- (D5)
Take and verify corrective action
- (D6)
Impement and validate corrective actions
- (D7)
Take preventive action
- (D8)
Congratulate your team
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Test
solution development
- Test
program development
- High
end solution : Verigy V93000
- Medium
end solution : Teradyne J750
- Cost
effective solution : Credence SC312/212
-
Test hardware development
- Test
methodology development
- Characterization
report
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Package
solution
- Traditional
package
- Stacked
package (2-die SCSP, 3-die SCSP, sandwich SCSP, MCM SCSP
¡K)
- SIP
solution (MCM, site by site, stacked, 3D package ¡K)
- Pb-free,
Rohs, green part solution
- Above
solution is provided by GSI's assembly partner.
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New
product qualification process
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